The global IC Package Substrates Market was valued at million in 2024 and is projected to reach US$ million by 2031, at a CAGR of %during the forecast period.
IC Package Substrates Market OverviewAn IC substrate is a crucial carrier material for integrated circuits, featuring internal circuitry that connects semiconductor chips to printed circuit boards (PCBs). These substrates not only provide electrical connectivity but also serve multiple functions:
- Protecting the circuit and sensitive components
- Managing heat dissipation
- Serving as a standardized module for IC components
IC substrates are essential in IC packaging, accounting for approximately 35% to 55% of the total packaging materials.
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Leading suppliers of IC package substrates in China include:
- SCC
- Nanya
- Access Substrates
The top three manufacturers hold a combined market share of over 50%, indicating a relatively consolidated market landscape.
- WB BGA (Wire Bond Ball Grid Array) – 39% market share
- FC-CSP (Flip Chip Chip Scale Package) – 38% market share
These packaging types are widely adopted for different performance and size requirements in electronic devices.
We have surveyed the IC Package Substrates manufacturers, suppliers, distributors, and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks
This report aims to provide a comprehensive presentation of the global market for IC Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Package Substrates. This report contains market size and forecasts of IC Package Substrates in global, including the following market information:
- Global IC Package Substrates market revenue, 2020-2025, 2026-2031, ($ millions)
- Global IC Package Substrates market sales, 2020-2025, 2026-2031, (K Sqm)
- Global top five IC Package Substrates companies in 2024 (%)
- Rising Adoption in Smartphones and PCs
Smartphones and personal computing devices (laptops and tablets) continue to be the dominant applications, accounting for over 85% of market usage. - Technological Shift Toward FC-CSP and WB BGA
Advanced packaging technologies like FC-CSP (38%) and WB BGA (39%) are leading the market due to their high performance and compact designs. - Strong Manufacturing Base in China
China remains a dominant player with key manufacturers like SCC, Nanya, and Access Substrates holding over 50% market share. - Increased Focus on Heat Dissipation and Reliability
Demand for substrates with better heat management and electrical performance is driving innovations in IC packaging. - Market Consolidation and Strategic Alliances
Leading companies are expanding via mergers and strategic collaborations to increase market reach and production capabilities.
Global IC Package Substrates market, by Type, 2020-2025, 2026-2031 ($ millions) & (K Sqm)
Global IC Package Substrates market segment percentages, by Type, 2024 (%)
- FC-BGA
- FC-CSP
- WB BGA
- WB CSP
- RF Module
- Others
Global IC Package Substrates market, by Application, 2020-2025, 2026-2031 ($ Millions) & (K Sqm)
Global IC Package Substrates market segment percentages, by Application, 2024 (%)
- Smart Phone
- PC (tablet and Laptop)
- Wearable Device
- Others
- Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies IC Package Substrates revenues in global market, 2020-2025 (estimated), ($ millions)
- Key companies IC Package Substrates revenues share in global market, 2024 (%)
- Key companies IC Package Substrates sales in global market, 2020-2025 (estimated), (K Sqm)
- Key companies IC Package Substrates sales share in global market, 2024 (%)
Further, the report presents profiles of competitors in the market, key players include:
- Unimicron
- Ibiden
- Nan Ya PCB
- Shinko Electric Industries
- Kinsus Interconnect Technology
- AT&S
- Semco
- Kyocera
- TOPPAN
- Zhen Ding Technology
- Daeduck Electronics
- ASE Material
- LG InnoTek
- Simmtech
- Shennan Circuit
- Shenzhen Fastprint Circuit Tech
- ACCESS
- Suntak Technology
- National Center for Advanced Packaging (NCAP China)
- Huizhou China Eagle Electronic Technology
- DSBJ
- Shenzhen Kinwong Electronic
- AKM Meadville
- Victory Giant Technology
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Q1. What are the key driving factors and opportunities in the IC Package Substrates market?
A: The main drivers include growing consumer electronics demand and semiconductor packaging innovations. Opportunities lie in 5G, IoT, and wearable device expansion.
Q2. Which region is projected to have the largest market share?
A: China is projected to dominate the market due to its strong manufacturing base and presence of major players.
Q3. Who are the top players in the global IC Package Substrates market?
A: Key players include SCC, Nanya, and Access Substrates, collectively accounting for over 50% of the market.
Q4. What are the latest technological advancements in the industry?
A: Advancements include improved heat dissipation designs and the widespread adoption of FC-CSP and WB BGA packaging.
Q5. What is the current size of the global IC Package Substrates market?
A: The market was valued at several million USD in 2024 and is projected to reach a significantly higher value by 2031.