The global IC and LED Lead Frames Market was valued at 3546 million in 2024 and is projected to reach US$ 5210 million by 2031, at a CAGR of 5.8% during the forecast period.
IC and LED Lead Frames Market OverviewLead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package mechanically. A lead frame consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.
Sumitomo Metal Mining Co., Ltd. (SMM) has withdrawn from the lead frame business, based on an assessment of the changing business environment. The lead frame market itself has gone from a growth market to the mature phase, resulting in over-commoditization of lead frame products. Moreover, the emergence of Chinese local manufacturers has intensified competition for these products. On March 17, 2017, Chang Wah Technology purchased SH Asia Pacific Pte. Ltd., a Singapore-based investment company, from SH Materials Co., Ltd. (SHM). In 2017, Jin Lin Technology has merger and acquisition three power device lead manufacturer from Japan Sumitomo Metals (SMM), which are SH Precision Co., Ltd (Japan), Suzhou SH Precision Co., Ltd (China) and Malaysian SH Precision Sdn Bhd (Malaysia). Nowadays, Jih Lin Technology is status as the top power devices lead frame manufacturer of the world. On 28 July 2020, ASM Pacific Technology, together with Wise Road Capital LTD and Asia-IO Capital Management Limited, announced the formation of a Strategic Joint Venture (SJV) for ASM Pacific Technologys Materials Segment Business Unit, which produces lead frames.
Grab Your Complimentary Sample Report
IC and LED Lead Frames Key Market Trends :- Growing Demand for Miniaturization
The increasing demand for smaller and more efficient electronic devices is driving innovation in IC and LED lead frames, leading to the adoption of thinner and high-density lead frame designs. - Rising Adoption of LED Technology
The shift toward energy-efficient lighting solutions is fueling the demand for LED lead frames, particularly in automotive, consumer electronics, and industrial applications. - Expansion of Semiconductor Packaging Industry
Advanced packaging techniques like Flip Chip and Quad Flat No-lead (QFN) packaging are gaining traction, requiring high-performance lead frames to support next-gen semiconductor devices. - Increasing Competition from Chinese Manufacturers
The rise of local Chinese manufacturers has intensified competition in the global market, leading to price pressures and increased production efficiency demands. - Strategic Mergers and Acquisitions
Leading market players are engaging in acquisitions and joint ventures to strengthen their market position and expand production capabilities.
Global IC and LED Lead Frames market, by Type, 2020-2025, 2026-2031 ($ millions) & (B Units)
Global IC and LED Lead Frames market segment percentages, by Type, 2024 (%)
- DIP
- SOP
- SOT
- QFP
- DFN
- QFN
- FC
- TO
- Others
Global IC and LED Lead Frames market, by Application, 2020-2025, 2026-2031 ($ Millions) & (B Units)
Global IC and LED Lead Frames market segment percentages, by Application, 2024 (%)
- Integrated Circuit
- Discrete Device
- LED
Competitor Analysis
The report also provides analysis of leading market participants including:
- Key companies IC and LED Lead Frames revenues in global market, 2020-2025 (estimated), ($ millions)
- Key companies IC and LED Lead Frames revenues share in global market, 2024 (%)
- Key companies IC and LED Lead Frames sales in global market, 2020-2025 (estimated), (B Units)
- Key companies IC and LED Lead Frames sales share in global market, 2024 (%)
Further, the report presents profiles of competitors in the market, key players include:
- Mitsui High-tec
- Shinko
- Chang Wah Technology
- Advanced Assembly Materials International
- HAESUNG DS
- SDI
- Fusheng Electronics
- Enomoto
- Kangqiang
- POSSEHL
- JIH LIN TECHNOLOGY
- Jentech
- Hualong
- Dynacraft Industries
- QPL Limited
- WUXI HUAJING LEADFRAME
- HUAYANG ELECTRONIC
- DNP
- Xiamen Jsun Precision Technology
Q: What are the key driving factors and opportunities in the IC and LED Lead Frames market?
A: The market is driven by growing demand for consumer electronics, automotive advancements, and increased semiconductor investments. Opportunities lie in IoT, 5G expansion, and high-power LED applications.
Q: Which region is projected to have the largest market share?
A: Asia-Pacific is expected to dominate the market due to the presence of major semiconductor manufacturers and high production capacities in China, Japan, and South Korea.
Q: Who are the top players in the global IC and LED Lead Frames market?
A: Leading companies include Chang Wah Technology, Jih Lin Technology, ASM Pacific Technology, and other key players engaged in mergers and acquisitions to strengthen their market position.
Q: What are the latest technological advancements in the industry?
A: Innovations include high-density lead frames, Flip Chip and QFN packaging, and eco-friendly materials to comply with environmental regulations.
Q: What is the current size of the global IC and LED Lead Frames market?
A: The market was valued at $3,546 million in 2024 and is projected to reach $5,210 million by 2031, growing at a CAGR of 5.8%.